Skip to content
1887
Volume 26, Issue 3
  • ISSN: 0032-1400

Abstract

Palladium and palladium-based materials are being increasingly accepted as substitutes for gold in contacts for separable electronic connectors. Since 1975 the favourable cost of palladium relative to gold has stimulated research in many areas of contact technology, including manufacturing processes, contact phenomena, testing and connector design. This has resulted in the development of several new materials systems involving electrodeposited coatings, clad inlays and weldments of palladium, palladium-silver alloys, gold-palladium-silver compositions and composite coatings with other metals that are equivalent to all-gold systems in many applications. This review traces the history of research on palladium for use in connectors, and summarises important results of studies of the environmental, tribological and contact properties of palladium materials.

Loading

Article metrics loading...

/content/journals/10.1595/003214082X263106117
1982-01-01
2024-03-29
Loading full text...

Full text loading...

/deliver/fulltext/pmr/26/3/pmr0026-0106.html?itemId=/content/journals/10.1595/003214082X263106117&mimeType=html&fmt=ahah

References

  1. 1Annual Review and Outlook”, 1978, J. Aron Commodities Corporation, New York [Google Scholar]
  2. Antler M. 2Kirk-Othmer Encyclopedia of Chemical Technology”, Vol. 8, 3rd Edn., Wiley-Interscience, New York, p. 641 [Google Scholar]
  3. Antler M. 3IEEE Trans. PHP, 1975, 11, 216 [Google Scholar]
  4. Reid F. H. 4Plating, 1965, 52, 531 [Google Scholar]
  5. Preston P. 5British Post Office, private communication [Google Scholar]
  6. Napp D. T. 6Proc. Fifth Plating in the Electronic Ind. Symp., Am. Electroplaters’ Soc., New York, 1975, p. 28 [Google Scholar]
  7. Donaldson J. G. 7Plating, 1974, 61, 222 [Google Scholar]
  8. Hain W. R., Clisura J. A., and Rudloff L. W. 8Proc. Holm Conf. on Electrical Contacts, Chicago, 1981, p. 241 [Google Scholar]
  9. Raub C. J. 9Proc. Symp. on Economic Use of and Substitution for Precious Metals in the Electronics Ind., Am. Electroplaters’Soc., Danvers, Mass., 1980 [Google Scholar]
  10. Morrissey R. J. 10Plating Surf. Finish., 1980, 67, (12), 44 [Google Scholar]
  11. Locarnini J.-M., and Ibl N. 11Proc. Second Int. Pulse Plating. Symp., Am. Electroplaters’Soc., Roscmont, Ill., Oct. 1981 [Google Scholar]
  12. Ibl N. 12op. cit.
  13. Pike-Biegunski M. J., and Bazzone R. 13Proc. Symp. on Economic Use of and Substitution for Precious Metals in the Electronics Ind., Am. Electroplaters’ Soc., Danvers, Mass., 1980 [Google Scholar]
  14. 14Anon., Plating Surf. Finish., 1980, 67, (11), 36 [Google Scholar]
  15. Cohen U., Walton K. R., and Sard R. 15 Denver, Oct. 1981
  16. Russell R. J., and Capp R. O. 16Insul./Circuits,Mar. 1981, p. 34 [Google Scholar]
  17. Bischoff A., Schnabl R., and Aldinger F. A. 17Proc. Holm Conf. on Electrical Contacts, Chicago, 1981, p. 89 [Google Scholar]
  18. Antler M., Drozdowicz M. H., and Haque C. A. 18IEEE Trans. Components, Hybrids Manuf. Technol., 1981, CHMT–4, (4), 482 [Google Scholar]
  19. Haque C. A., and Antler M. 19Proc. Holm Conf. on Electrical Contacts, Chicago, 1981, p. 183 [Google Scholar]
  20. Sharma S. P. 20op. cit., p. 191
  21. Borchert L., Mayer U., Murr A., Potinecke J., and Schiff K. L. 21Proc. Ninth Int. Conf. on Electric Contact Phenom., Chicago, 1978, p. 273 [Google Scholar]
  22. Antler M. 22Proc. Eleventh Int. Conf. on Electric Contact Phenom., West Berlin, June 1982 [Google Scholar]
  23. Shimosato S. 23Electron. Commun. Jpn., 1972, 55–C, (9), 98 [Google Scholar]
  24. Abbott W. H. 24Proc. Holm Seminar on Electrical Contacts, Chicago, 1973, p. 94 [Google Scholar]
  25. Long T. R., and Bradford K. F. 25Proc. Holm Conf. on Electrical Contacts, Chicago, 1975, p. 145 [Google Scholar]
  26. Antler M., and Dunbar J. J. 26op. cit., ref. 18, 1978, CHMT–1, 17
  27. Borchert L., and Murr M. 27Proc. Tenth Int. Conf. on Electric Contact Phenom., Vol. II, Budapest, 1980, p. 989 [Google Scholar]
  28. Sharma y, and Sproles E. S. 28Proc. Holm Conf. on Electrical Contacts, 1981, p. 203 [Google Scholar]
  29. Conrad L. R. 29Proc. Annu. Connectors and Interconnections Symp., Philadelphia, Nov. 1981, p. 342 [Google Scholar]
  30. Fairweather A., Lazenby F., and Marr D. 30Trans. Inst. Met. Finish, 1976, 54, 145 [Google Scholar]
  31. Chaikin S. W. 31Electro-Technol., 1961, 68, 70 [Google Scholar]
  32. Huck M. 32Proc. Ninth Int. Conf. on Electric Contact Phenom., Chicago, 1978, p. 619 [Google Scholar]
  33. Antler M. 33Platinum Metals Rev., 1966, 10, (1), 2 [Google Scholar]
  34. Antler M. 34IEEE Trans. PHP, 1973, 9, 4 [Google Scholar]
  35. Antler M. 35op. cit., ref. 18, 1981, CHMT–4, (1), 15
  36. Antler M. 36Fretting of Electrical Contacts”, Symp. on Mater. Eval. Under Fretting Conditions, Natl. Bur. Stand., Gaithersburg, Md., 3 June 1981, (ASTM Spec. Tech. Publ. No. 780) [Google Scholar]
  37. Antler M., Preece C. M., and Kaufmann E. N. 37op. cit., ref. 18, 1982, CHMT–5, (1), 81
  38. Grossman H. 38Trans. Inst. Met. Finish., 1978, 56, 54 [Google Scholar]
  39. Sato T., Matsui Y., Okada M., Murakawa K., and Henmi Z. 39op. cit., ref. 18, 1981, CHMT–4, (1), 10
  40. Crosby J. N. 40Proc. Symp. on Economic Use of and Substitution for Precious Metals in the Electronics Ind., Am. Electroplaters’ Soc., Danvers, Mass., 1980 [Google Scholar]
  41. Angus H. C. 41Instrum. Prac., 1966, 20, 241 [Google Scholar]
  42. Grossmann H., and Huck M. 42Proc. Tenth Int. Conf. on Electric Contact Phenom., Vol. 1, Budapest, 1980, p. 401 [Google Scholar]
  43. Hermance H. W., and Egan T. F. 43Bell Syst. Tech. J., 1958, 37, 739 [Google Scholar]
  44. Sproles E. S. 44Proc. Annu. Connectors and Interconnections Symp., Philadelphia, Nov., 1981, p. 267 [Google Scholar]
  45. Crossland W. A., and Murphy P. M. K. 45IEEE Trans. PHP, 1974, 10, (1), 64 [Google Scholar]
  46. Antler M. 46Proc. Electronic Components Conf., San Diego, Cal., May 1982 [Google Scholar]
  47. Antler M., and Sproles E. S. 47op. cit., ref. 18, 1982, CHMT–5, (1), 158
  48. Bader W. G. 48op. cit., ref. 40
http://instance.metastore.ingenta.com/content/journals/10.1595/003214082X263106117
Loading
/content/journals/10.1595/003214082X263106117
Loading

Data & Media loading...

  • Article Type: Research Article
This is a required field
Please enter a valid email address
Approval was a Success
Invalid data
An Error Occurred
Approval was partially successful, following selected items could not be processed due to error