Skip to content
1887
Volume 8, Issue 2
  • ISSN: 0032-1400

Abstract

In the electrodeposition of rhodium from the sulphate bath normally employed highly stressed deposits are produced. In this paper the author describes an investigation of the effects of contamination by organic compounds contained in masking paints on these stresses, and shows that the results of earlier studies on internal stress may have been vitiated by the employment of a method relying on such paints for masking one side of the cathode. An apparatus completely avoiding the use of paint was designed in the course of the present investigation, and an improved paint, giving markedly less contamination and lower stresses in the deposit, was formulated for use in commercial rhodium plating practice.

Loading

Article metrics loading...

/content/journals/10.1595/003214064X825559
1964-01-01
2024-03-29
Loading full text...

Full text loading...

/deliver/fulltext/pmr/8/2/pmr0008-0055.html?itemId=/content/journals/10.1595/003214064X825559&mimeType=html&fmt=ahah

References

  1. Soderburg H. G., and Graham H. K. and Proc. Amer. Electroplaters’ Soc., 1947, 34, 74 [Google Scholar]
  2. Hoar T. P., and Arrowsmith D. J. and Trans. Inst. Metal Finishing, 1957, 34, 354 [Google Scholar]
  3. Brenner A., and Senderoff S. and Proc. 35th Ann. Conv. Amer. Electroplaters’ Soc., 1948, 3576 [Google Scholar]
  4. Kushner J. B.Plating, 1954, 41, No. 10, 1146 [Google Scholar]
  5. Reid F. H.Trans. Inst. Metal Finishing, 1958-9, 36, 74 [Google Scholar]
  6. Reid F. H.Metallurgical Rev., 1963, 8, 175 [Google Scholar]
  7. Weisner H. J., and Meers H. A. and Plating, 1956, 43, 347 [Google Scholar]
http://instance.metastore.ingenta.com/content/journals/10.1595/003214064X825559
Loading
/content/journals/10.1595/003214064X825559
Loading

Data & Media loading...

  • Article Type: Research Article
This is a required field
Please enter a valid email address
Approval was a Success
Invalid data
An Error Occurred
Approval was partially successful, following selected items could not be processed due to error