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1887
Volume 31, Issue 1
  • ISSN: 0032-1400

Abstract

Palladium-based contact materials are replacing gold finishes on the contacts of many separable connectors used in telecommunications systems in the United States of America due to their lower cost. Before this was possible, however, methods had to be developed for: inhibiting the corrosive attack of palladium by certain chlorine-containing compounds in the atmosphere, retarding the formation of insulating frictional polymers on palladium, and improving its wear resistance. Also, improved manufacturing techniques for palladium contact materials were necessary. An alloy, clad 60 per cent palladium-40 per cent silver having a small amount of gold diffused into its near surface region, and a new palladium electroplating process which is used with a thin gold overplate, were developed. The technology behind these developments is described, and an example of the application of the new materials in a major connection system is given.

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1987-01-01
2024-02-25
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