Skip to content
1887
Volume 43, Issue 1
  • ISSN: 0032-1400

Abstract

Platinum metals, particularly platinum and palladium, are used extensively in low resistance, relatively stable and laterally uniform ohmic contacts made to semiconductor devices formed from Group III and V elements. Palladium is primarily utilised as one component of a multilayer metallisation structure, improving adhesion to the semiconductor, while platinum is commonly used as a diffusion barrier to minimise interdiffusion between metal and semiconductor components. This paper describes the roles of platinum and palladium in ohmic contacts, gives examples of their typical utilisation and outlines the design considerations associated with the formation of reliable ohmic contacts.

Loading

Article metrics loading...

/content/journals/10.1595/003214099X431212
1999-01-01
2024-02-27
Loading full text...

Full text loading...

http://instance.metastore.ingenta.com/content/journals/10.1595/003214099X431212
Loading
  • Article Type: Research Article
This is a required field
Please enter a valid email address
Approval was a Success
Invalid data
An Error Occurred
Approval was partially successful, following selected items could not be processed due to error